Why Design Data Management and Analytics aren’t just ordinary Big Data

By Eric

SemiconductorsI’m an electronics engineer who spent a part of his career in the business intelligence and analytics domain. In that regard, I’m always interested in technology and business areas that have unique analytics needs. Semiconductor design closure is one such domain. With 14 nanometer geometry fabrication now coming on-line, the complexity of integrated circuits is taking another geometric step in complexity as large projects can have 200+ IP blocks in their designs (see figure below).

Variability and Velocity are more critical than Volume

When taking into consideration that millions of transistors can constitute a block and that blocks can be chosen from libraries in the thousands, and that there can be multiple variations of a block, the analytics challenge approaches that of Big Data. Though, this not necessarily because of overall data size, but because of data complexity, variability and velocity.

For these large projects, then, the effort to meet timing, power, IR drop and other design parameters takes geometrically longer…yet again. Of course, some of this increased verification effort can be done in parallel by multiple design teams, each working on sub-sections of the chip. But, ultimately the entire system design has to be simulated to assure right design first time. I’m sure most would agree with me that system failure often happens at interfaces. Whether it’s an interface within a design or a responsibility interface between designers, it’s the same situation.

Why ordinary Big Data analytics won’t do the job

Effective analytics for design testing and verification provides a way to analyze interface operation from all relevant perspectives. Coming back to the topic of Big Data, my view is that commonly known Big Data analytics tools could be helpful, but are not sufficient to meet this requirement. In particular, I observe that appropriate semiconductor big data analytics must have the following capabilities:

  • Support for the hierarchical nature of chip design.
  • Ability to integrate information from multiple design tools and relate them in some way to each other to indicate relevant cause/effect relationships.
  • The ability to compare and contrast these relationships using graphical analytics to expose key relationships super quickly.
  • The ability to easily zoom, pivot, filter, sort, rank and do other kinds of analytics tasks on data to gain the right viewpoints.
  • The ability to deliver these analytics with minimal application admin or usage effort.
  • Effective visualizations for key design attributes unique to semiconductor projects.
  • The ability to process data from analog, digital and the other types of common EE design and simulation tools.
  • The ability to handle very complex, large chip design data structures so that requirement, specification and simulation consistency is maintained.

It seems to me that semiconductor design engineers have been quietly contending with Big Data analytics challenges even though they haven’t necessarily been part of the mainstream Big Data conversations. Yet, the tools in use for chip design perhaps have some very interesting capabilities for other technical and business disciplines. My $.02.

Also, we’re going to be at the Design Automation Conference in San Francisco this year again. We will have a full presentation and demo agenda, a cocktail hour and prizes, join us!

Eric ROGGE is a member of the High-Tech Industry team. You can find him on Twitter @EricAt3DS.

Excitement Engineered: RTT Becomes 3DXCITE

By Aurelien

RTT becomes 3DXCITE

Last December, we announced the acquisition of Realtime Technology (RTT), including Bunkspeed. We welcomed a talented team of over 750 people to the Dassault Systemes family, bringing with them breathtaking rendering technology and design services.

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Today, we’re thrilled to announce that RTT is adopting a new name and identity as the latest 3DS brand: 3DXCITE. In fact, you could say that we’re “3DXCITEd!”

The creation of the 3DXCITE brand is much more than a renaming of RTT. It embodies our conviction that 3DEXPERIENCE goes well beyond engineering, enhancing the entire business cycle across all communication channels with powerful, streamlined and efficient storytelling tools.

In today’s experience economy, competitive differentiation rarely happens from a purely technological standpoint. The emotional experience offered along with a product is often the key to opening (or expanding) new market opportunities. Listen to Monica Menghini, Dassault Systemes EVP Corporate Strategy, Industry and Marketing, explain how innovations happen in the experience economy:

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But how can this emotion be conveyed from Design and Engineering to Marketing and Sales? Take a look at the image below (via Wikipedia) showing the different stages of PLM.

PLM stages (source: Wikipedia)

Today, most PLM vendors can address the Design, Engineering or Manufacturing stages with mature solutions. But can they address the Marketing (upstream experiences) and Sales (downstream experiences) stages? With the addition of 3DXCITE, Dassault Systemes adds these capabilities. Now you can seamlessly leverage the original, single source 3D Master from Design and Engineering across Marketing and Sales, offering a virtual–and accurate–experience to your final customer or consumer. That’s 3DXCITE on the 3DEXPERIENCE Platform: Excitement Engineered.

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So, are you 3DXCITEd? Learn more about 3DXCITE on www.3ds.com/3dxcite, and follow @3DEXCITE on Twitter!

3DXCITE

Love.by.me, YOUR 3D-printed Jewel

By Fred

Would you like to surprise your loved ones ? Build a unique piece of jewelry with your names in 3D — online , easy, and starting from 13€!

Jewelry reinvented – a new innovative design concept, mixing 3D printing and generative online design: love.by.me (use Chrome or FireFox for a better experience)

Generated on the cloud with CATIA, the 3D design is created from your name and your loved one’s, resulting in a unique piece of jewelry. Available in several sizes, colors and materials (including Silver!), the jewel is 3D-printed, making custom-made jewelry available at an affordable price!

This new type of online 3DEXPERIENCE allows consumers to act on the design intent, ultra-personalization made easy. The frontier between manufacturers and consumers is shrinking as we now can make our own products virtually AND physically. Consumer becomes a Consum’actor!

If you like the love.by.me concept, help us make it viral by sharing pictures of your piece on Pinterest, Facebook or Twitter (tag your photo  #winyoursilverheart and #lovebyme ; the most retweeted before June 30th will win a 3D-printed silver heart!)

Watch the video below to see love.by.me in action, or go ahead and create your own 3D-printed heart now :-)

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Beyond PLM (Product Lifecycle Management), Dassault Systèmes, the 3D Experience Company, provides business and people with virtual universes to imagine sustainable innovations. 3DSWYM, 3D VIA, CATIA, DELMIA, ENOVIA, EXALEAD, NETVIBES, SIMULIA and SOLIDWORKS are registered trademarks of Dassault Systèmes or its subsidiaries in the US and/or other countries.